Chinese memory chipmaker Yangtze Memory Technologies (YMTC) has overtaken Samsung and SK Hynix to become China’s largest NAND flash chip producer in 2026, capturing a 38.5% market share.
YMTC increased its share from 28% last year, while Samsung dropped from 36% to 33.5%. SK Hynix remained in third place, with its share declining from 20% to 17%.
The shift has prompted Samsung and SK Hynix to upgrade their chip manufacturing facilities in China to improve production capabilities and compete with the growing Chinese manufacturer.
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Samsung’s Production Upgrade
Samsung’s NAND manufacturing facility in Xian, China, accounts for approximately 40% of its global NAND production capacity.
However, the factory currently produces older NAND chips with around 200 layers. Higher layer counts allow manufacturers to increase storage capacity within individual chips.
According to Reuters, Samsung is upgrading the facility to manufacture ninth-generation V-NAND (V9) chips with 286 layers.
The company plans to begin production with 5,000 wafers by the end of 2026 before significantly increasing output to 40,000 wafers by the end of 2027.
Samsung’s Newer NAND Technology
Despite the planned upgrade, Samsung’s V9 technology is no longer its latest generation.
Earlier this year, the company introduced its tenth-generation V-NAND (V10) technology, featuring more than 400 layers.
Compared with V9, the newer chips offer faster performance, improved power efficiency, and increased storage density.
Samsung’s decision to upgrade its Chinese facility to V9 means the factory will continue using older technology than the company’s latest NAND generation.
SK Hynix Upgrades China Factory
SK Hynix is also upgrading its NAND manufacturing facility in Dalian, China, which previously belonged to Intel before its NAND business was acquired and transferred under Solidigm.
The facility currently manufactures 192-layer NAND chips. However, SK Hynix has received permission from US authorities to produce chips with up to 240 layers, according to Reuters.
The company also plans to conduct research and development on NAND chips with more than 300 layers, although it will need additional US approval.
Meanwhile, Solidigm is preparing for a potential listing on the Nasdaq stock exchange but faces opposition from shareholders and regulators. SK Hynix is also discussing plans to establish NAND manufacturing operations in the United States, potentially with Intel’s assistance.
US Export Restrictions
Both Samsung and SK Hynix face restrictions on upgrading their Chinese factories because the US controls exports of advanced semiconductor manufacturing equipment.
Companies must obtain licenses from the US Commerce Department’s Bureau of Industry and Security (BIS) to install American-made semiconductor equipment in China.
In 2025, the agency stated that it would not approve licenses for expanding production capacity or upgrading technology at Chinese factories owned by foreign semiconductor manufacturers.
However, Samsung and SK Hynix are proceeding with their planned upgrades while consulting US authorities.
Reuters reported that it could not independently determine the full extent of US export approvals for the equipment required.
China’s Growing NAND Market Share
YMTC’s growing market share highlights increasing competition for South Korean semiconductor manufacturers in China.
According to research firm Omdia, YMTC captured 38.5% of China’s NAND market in the second quarter of 2026, compared with 28% throughout 2025. Samsung’s share fell from 36% to 33.5%, while SK Hynix declined from 20% to 17%.
YMTC mainly manufactures 160-layer and 232-layer NAND chips but also produces limited quantities of 294-layer products. The company is reportedly preparing to manufacture chips with more than 300 layers.
Samsung and SK Hynix are now working to modernize their Chinese manufacturing facilities while navigating US export restrictions and rising competition from local chipmakers.
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