Huawei has confirmed that the image sensor inside its XMAGE Z10 module camera was designed in-house by HiSilicon, its chip design unit. The disclosure came at the company's 2026 Kirin media briefing at its Lianqiu Lake R&D center in Shanghai on October 13, where Xu Songyu, head of wireless terminal chip product management in Huawei's semiconductor business, gave more detail on the Kirin 9050 series beyond the architecture diagram shown earlier the same day.
According to IT Home's on-site report, the Kirin 9050 series is built to work closely with a new generation of self-developed CMOS image sensors, fully custom optics and a professional imaging ISP, so that Huawei can tune the whole chain from sensor and lens to on-chip processing. Xu said the XMAGE Z10 uses a HiSilicon-developed 50-megapixel 1-inch RYYB sensor. Earlier coverage of the module had described the sensor's size and color filter, but had not identified who designed it.
The XMAGE Z10 launched on October 1 alongside the Mate 90 series. It attaches through Huawei's HyperClick mount, which comes in H1 and H2 versions for the Mate 90 Pro Max Collector's Edition and the Mate 90 RS, and supports screwless quick release. It has its own optical image stabilization module that works with the Kirin chip, and it is priced at 5,999 yuan, or 19,499 yuan as a collector's kit.
On security, Huawei said the Kirin 9050 series is among the first mobile SoCs to pass authoritative testing for resistance to quantum attacks, with support for post-quantum cryptography. The company also called it the first chip-level privacy security SoC platform: a mobile security processor works with a separate security chip to protect secure boot, data, privacy and communications.
For audio and video, the chip combines DSP and NPU heterogeneous computing with low-latency FFTS scheduling and hardware H.266 video decoding. Huawei said this improves call clarity and audio processing, and makes video playback smoother and more power-efficient on weak networks.
Huawei did not name the testing body behind the anti-quantum certification or give further specifications for the new sensor.
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