The ADC34DSO75 samples at 3 GSPS while TI also showcases 800 V power solutions and low-jitter clocking for AI infrastructure.
At the Open Compute Project (OCP) Global Summit, Texas Instruments (TI) introduced the ADC34DSO75, an analog-to-digital converter (ADC) designed for continuous, low-power, event-based remote monitoring with nanosecond-level resolution.
As AI workloads increase, data center operators are addressing power instability, real-time monitoring and signal degradation. TI is showcasing the ADC34DSO75 and other analog solutions for AI infrastructure at Booth E45. Demonstrations include:
- Nanosecond-level telemetry: The ADC34DSO75 is a 3 gigasamples-per-second (GSPS) ADC designed for continuous, low-power, event-based remote monitoring. Its high-speed sampling and on-chip digital signal processing support the detection and capture of transient events on low-voltage, high-current power rails.
The device can monitor power rails remotely and reduce the need for on-site debugging equipment such as oscilloscopes. Continuous monitoring can help data center operators identify power-related issues and investigate faults without interrupting system operation.
- High-voltage power delivery: The LMI800PS is an 800 V isolated hot-swap controller that integrates inrush-current control and power-path protection. Its isolated bias supply and PMBus telemetry can reduce board area by more than 60% compared with a discrete solution using five integrated circuits.
The device supports 5 kVrms reinforced isolation and more than 8 mm of creepage. It is designed to support power insertion and fault isolation while limiting the effect of a load failure on a shared power bus. The LMI800PS supports both ±400 V and 800 V distribution architectures.
- Low-jitter clocking: The LMK6B is a bulk acoustic wave (BAW)-based oscillator designed for applications requiring low jitter and power-supply noise rejection. It provides 9.6 femtoseconds of jitter at 625 MHz for data center networking applications with transmission rates of up to 3.2 Tbps.
TI will also display its 800 VDC power solutions on NVIDIA’s MGX AI Factory Ecosystem wall. The solutions include an 800 V hot-swap controller for input power protection, an 800 V-to-12 V DC/DC bus converter for tray power conversion and an 800 V-to-6 V DC/DC bus converter with gallium nitride (GaN) power stages.
At OCP, TI power electronics engineer David Reusch will present “800 V Data Center DC/DC Design Considerations, Topology Comparisons and Trade-Offs” on Oct. 15 at 2:45 p.m. in Room 230A.
For more information, visit ti.com.