By Kim Han-joo
SEOUL, Oct. 16 (Yonhap) -- SK hynix Inc. said Friday that it has showcased its next-generation artificial intelligence (AI) memory technologies aimed at expanding the boundaries of AI infrastructure beyond conventional high-bandwidth memory (HBM).
The company presented the technologies at the OCP Global Summit 2026, held in California from Tuesday to Thursday (local time). The summit is an annual conference organized by the Open Compute Project Foundation that brings together engineers and industry leaders.
The South Korean chip giant said it divided its exhibition space into two sections.
The front section, dubbed the memory section, showcased the company's flagship products, while the larger rear section, called the system demo section, featured memory solutions designed to support next-generation server ecosystems.
Kim Ho-sik, a senior vice president at SK hynix, introduced MARS (Memory-Centric AI Rack-Scale System), a disaggregated rack-scale architecture designed to coordinate computing and memory resources seamlessly.
Kim highlighted progress in High Bandwidth Flash (HBF), a technology aimed at addressing the industry's growing demand for memory capacity.
The company also unveiled its second-generation 256-gigabyte memory product based on Compute Express Link (CXL) 3.2, offering more than twice the bandwidth of its predecessor and an approximately 30 percent improvement in energy efficiency.
This image, provided by SK hynix Inc. on Oct. 16, 2026, shows its booth at the OCP Global Summit 2026, held in California. (PHOTO NOT FOR SALE) (Yonhap)
khj@yna.co.kr
(END)