Samsung Electronics (005930.KS) unveiled its vision for the Yongin national semiconductor industrial complex in Gyeonggi Province, a 360 trillion won ($250 billion) project, at South Korea's largest chip industry exhibition. The company set up a separate exhibition space for the first time this year, presenting a blueprint for an advanced chipmaking hub that brings fabs and suppliers together in one place. Samsung showcased everything from next-generation high-bandwidth memory to the latest base die for HBM built on an advanced logic process, along with advanced packaging technologies, underscoring its integrated chip competitiveness for the artificial intelligence era.
Samsung said it is taking part in SEDEX 2026, hosted by the Korea Semiconductor Industry Association at COEX in Seoul's Gangnam district from the 14th through the 16th, where it is introducing its development plan for the Yongin complex and its next-generation chip technologies.
This year's exhibition is organized around the theme "Architecting AI Systems" and is divided into six areas: next-generation technology, cloud AI, edge AI, physical AI, the semiconductor cluster and win-win cooperation. With about 10,000 people visiting Samsung's booth last year, the company again prepared hands-on content to help general visitors grasp chip technology more easily.
The centerpiece of this year's exhibition is the newly created "semiconductor cluster zone." There, Samsung explains the roles of its major domestic chip production and development sites and lays out its plan for the Yongin complex. The Yongin national industrial complex is an advanced chipmaking base that Samsung is building with about 360 trillion won in investment. The company aims to begin site preparation and fab construction next year and to bring the first production line online in October 2029.
The Yongin complex will house not only Samsung's own production facilities but also about 70 companies, including materials, parts and equipment makers and fabless chip design firms. The idea is to gather component suppliers and technology developers around the chip fabs to form a single large semiconductor industry ecosystem. Samsung expects that roads, transportation and housing, along with other living infrastructure, will be expanded alongside the complex, contributing to the local economy.
The exhibition space devoted to next-generation chips features core technologies aimed at the AI era. Samsung is displaying HBM4E, its seventh-generation high-bandwidth memory, and a base die for HBM4E built on a 4-nanometer logic process.
The company is also showing models of zHBM and zNAND-O, three-dimensional memory products that shorten the distance data travels between AI processors and memory. Advanced packaging technologies are on display as well, including 2.3D Cube-E, which links multiple chips closely side by side, and 3D Cube-H, which stacks them vertically. Samsung is also exhibiting optical communication technology that converts electrical signals into light to move large volumes of data quickly. The Exynos 2600 smartphone processor and a 200-megapixel image sensor are among the other products on show.
In a separate area, Samsung highlights the results of its cooperation with suppliers, the foundation of the chip industry. Among the examples are funding, technology and workforce support programs it has run for 45 years since establishing Hyupsunghoe, a council of partner companies, in 1981.
